Handbook

The first section of this course includes an introduction to processing of inorganic materials, semiconductor processing, single crystal growth of Si, GaAs, carbon-based material, thin film processing (physical and chemical vapour deposition), sputtering and pulse laser deposition methods. It shall also cover advanced nanostructures such as nanoparticles, nanowires, nanotubes, wet chemical production methods, electro-less and electrochemical production methods. In addition, this section will cover sustainable materials processing of waste plastic, electronics waste processing and sustainable iron and Steel making.

Course material covered in the second section includes secondary metals processing such as fixed and continuous casting processes including sand-box casting, investment casting, die-casting, slab and twin-roll strip-casting; metal billet and sheet rolling; tube and bar extrusion; forging techniques; Soldering, Brazing and Welding, Subtractive manufacturing including multi-axis milling, machining, grinding and spark erosion; Additive manufacturing including typical 3D printing techniques such as extrusion melting, selective laser melting/sintering, e-beam melting and droplet ejection.