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Overview

The first section of this course includes an introduction to processing of inorganic materials, semiconductor processing, single crystal growth of Si, GaAs, carbon-based material, thin film processing (physical and chemical vapour deposition), sputtering and pulse laser deposition methods. It shall also cover advanced nanostructures such as nanoparticles, nanowires, nanotubes, wet … For more content click the Read More button below. Course material covered in the second section includes secondary metals processing such as fixed and continuous casting processes including sand-box casting, investment casting, die-casting, slab and twin-roll strip-casting; metal billet and sheet rolling; tube and bar extrusion; forging techniques; Soldering, Brazing and Welding, Subtractive manufacturing including multi-axis milling, machining, grinding and spark erosion; Additive manufacturing including typical 3D printing techniques such as extrusion melting, selective laser melting/sintering, e-beam melting and droplet ejection.

Delivery

In-person - Standard (usually weekly or fortnightly)

Fees

Pre-2019 Handbook Editions

Access past handbook editions (2018 and prior)