Handbook

This first section of this course includes an introduction to processing of inorganic materials, semiconductor processing, single crystal growth of Si, GaAs, carbon-based material, thin film processing (physical and chemical vapour deposition), sputtering and pulse laser deposition method advanced nanostructures such as nanoparticles, nanowires, nanotubes, wet chemical methods, electro-less and electrochemical methods. In addition, this course will cover sustainable materials processing- waste plastic, electronics waste processing and sustainable iron and Steel making.

Course material covered in the second section includes secondary metals processing such as fixed and continuous casting processes including sand-box casting, investment casting, die-casting, slab and twin-roll strip-casting; metal billet and sheet rolling; tube and bar extrusion; forging techniques; Powder consolidation techniques including hot isostatic pressing and spark plasma sintering; Soldering, Brazing and Welding, Subtractive manufacturing including multi-axis milling, machining, grinding and spark erosion; Additive manufacturing including typical 3D printing techniques such as extrusion melting, selective laser melting/sintering, e-beam melting and droplet ejection.